PART |
Description |
Maker |
TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 4A die sawn Diodes - HV Chips - 600V, 4A die unsawn
|
Infineon
|
IXFN340N07 IXFN340N0704 |
HiPerFET?/a> Power MOSFETs Single Die MOSFET HiPerFET⑩ Power MOSFETs Single Die MOSFET HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
PUMA2U8002I-25 PUMA2U8002I-20 PUMA2U8002M-15 PUMA2 |
DIE SALE, 1.8V,11MIL(SERIAL EE) x32 EPROM Module 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE) 8-TSSOP, PB/HALO FREE,NiPdAu, 1.8V(SERIAL EE) 8 TSSOP, PB/HALO FREE, IND TEMP, 1.8V(SERIAL EE) X32号存储器模块 8-SAP,PB/HALO FREE,IND TEMP,2.7V(SERIAL EE) X32号存储器模块
|
NXP Semiconductors N.V. Amphenol, Corp.
|
IXFK44N50F IXFX44N50F |
HiPerRF Power MOSFETs F-Class MegaHertz Switching Single MOSFET Die 44 A, 500 V, 0.12 ohm, N-CHANNEL, Si, POWER, MOSFET FILM/M CAPACITANCE=4.7 VOLT=100 HiPerRF Power MOSFETs F-Class MegaHertz Switching Single MOSFET Die
|
IXYS, Corp. ETC[ETC] IXYS[IXYS Corporation]
|
3606 3601 |
Die Cast Aluminum Box Painted, Size “D Die Cast Aluminum Box Painted, Size 隆掳D隆卤
|
Pomona Electronics
|
11-40-2091 1140-2091 0011-40-2091 |
Terminator Die
|
Molex Electronics Ltd.
|
0011-40-2211 0011402211 |
Terminator Die
|
Molex Electronics Ltd.
|
0011-40-2192 1140-2192 001140-2192 |
Terminator Die
|
Molex Electronics Ltd.
|
11-40-2009 T8307A 1140-2009 0011-40-2009 001140-20 |
Terminator Die
|
Molex Electronics Ltd.
|